3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier-Reference-Cited by-同舟云学术

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3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE International Symposium on Assembly and Manufacturing (ISAM)
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Author:

Pfeffer Michael,Goth Christian,Craiovan Daniel,Franke Jorg

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5934626/5942286/05942362.pdf?arnumber=5942362

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