A Virtual Prototyping System for Silicon-Carbide Power Modules-Reference-Cited by-同舟云学术

A Virtual Prototyping System for Silicon-Carbide Power Modules

Published:2023-03-19 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Applied Power Electronics Conference and Exposition (APEC)
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Author:

Neumaier Klaus¹,Valenta Vaclav²,Chu Jonathan³,Xiao Yunpeng⁴,Benczkowski Stan⁵,Marquis Bob⁶,Yadav Sameer¹,Harper Jonathan¹,Picha Ondrej⁷,Thirukoluri Rajani¹,Paul Roveendra⁸,Zhang Leon⁹,Bidzishvili Levan¹,Bordignon Thierry¹⁰,Victory James⁸

Affiliation:

1. onsemi,Aschheim,Germany

2. onsemi,Brno,Czech Republic

3. onsemi,Hong Kong

4. onsemi,Shanghai,China

5. onsemi,Mountain Top,PA,USA

6. onsemi,East Greenwich,RI,USA

7. onsemi,Roznov,Czech Republic

8. onsemi,Sunnyvale,CA,USA

9. onsemi,Phoenix,AZ,USA

10. onsemi,Toulouse,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10131044/10130846/10131595.pdf?arnumber=10131595

Reference10 articles.

1. Electrothermal PSpice Modeling and Simulation of Power Modules

2. Directly Cooled Silicon Carbide Power Modules: Thermal Model and Experimental Characterization;mauromicale;PCIM Europe digitaldays 2021 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management,0

3. A physically based scalable SPICE model for silicon carbide power MOSFETs

4. Tools for Broadband Electromagnetic Modeling of Power Semiconductor Packages and External Circuit Layouts

5. Reduction of parasitic capacitance in 10 kV SiC MOSFET power modules using 3D FEM

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1. Automated Multidisciplinary Analysis And Lab Verification for Silicon-Carbide Based Power Modules;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07