Effect of Oxygen plasma treatment on the performance of GaN-based MIS-HEMTs
Author:
Affiliation:
1. University of Fukui,Graduate School of Engineering,Fukui,Japan,910-8507
2. Kwansei Gakuin University,School of Engineering,Hyogo,Japan,669-1337
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9975349/9975304/09975436.pdf?arnumber=9975436
Reference6 articles.
1. Impact of oxygen plasma treatment on the dynamic on-resistance of AlGaN/GaN high-electron-mobility transistors
2. Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate, and surface passivation
3. AlGaN/GaN metal–insulator–semiconductor high-electron mobility transistors with high on/off current ratio of over 5 × 1010achieved by ozone pretreatment and using ozone oxidant for Al2O3gate insulator
4. Highly reduced current collapse in AlGaN/GaN high-electron-mobility transistors by combined application of oxygen plasma treatment and field plate structures
5. Insulated gate and surface passivation structures for GaN-based power transistors
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. High performance normally-off recessed-gate GaN-based MIS-HEMTs achieved by oxygen plasma treatment;2023 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK);2023-11-16
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