Mechanical properties and joint reliability improvement of Sn-Bi alloy-Reference-Cited by-同舟云学术

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Mechanical properties and joint reliability improvement of Sn-Bi alloy

Published:2011-12 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 13th Electronics Packaging Technology Conference
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Author:

Jianhui Wang ,Long Wen ,Jianwei Zhou ,Myungkee Chung

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6178148/6184374/06184470.pdf?arnumber=6184470

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Annealing Treatment on Electromigration Resistance of Low-Temperature Sn-57Bi-1Ag Solder Interconnect;Journal of Electronic Materials;2024-09-05

2. Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints;Journal of Electronic Materials;2024-08-06

3. Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys;Journal of Electronic Materials;2023-12-15

4. Risk Assessment of Hybrid Low Temperature Solder on Surface Mount Technology and Board Level Reliability for BGA Packages;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint;Journal of Materials Science: Materials in Electronics;2022-09-19

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