Status and Performance of Integration Modules Toward Scaled CMOS with Transition Metal Dichalcogenide Channel-Reference-Cited by-同舟云学术

Status and Performance of Integration Modules Toward Scaled CMOS with Transition Metal Dichalcogenide Channel

Published:2023-12-09 Issue: Volume: Page:
ISSN:
Container-title:2023 International Electron Devices Meeting (IEDM)
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Author:

Chou Ang-Sheng¹,Hsu Ching-Hao¹,Lin Yu-Tung¹,Arutchelvan Goutham¹,Chen Edward¹,Hung Terry Y.T.¹,Hsu Chen-Feng¹,Chou Sui-An¹,Lee Tsung-En¹,Madia Oreste²,Doornbos Gerben²,Su Yuan-Chun¹,Azizi Amin³,Sathaiya D. Mahaveer⁴,Cai Jin²,Wang Jer-Fu¹,Chung Yun-Yan¹,Wu Wen-Chia¹,Neilson Katie³,Yun Wei-Sheng¹,Hsu Yu-Wei⁵,Hsu Ming-Chun⁵,Hou Fa-Rong⁵,Shen Yun-Yang⁶,Chien Chao-Hsin⁷,Wu Chung-Cheng⁴,Wu Jeff⁴,Wong H.-S. Philip¹,Chang Wen-Hao⁶,van Dal Mark²,Cheng Chao-Ching¹,Wu Chih-I⁵,Radu Iuliana P.¹

Affiliation:

1. TSMC,Corporate Research,Hsinchu,Taiwan

2. TSMC,Pathfinding,Hsinchu,Taiwan

3. TSMC,Corporate Research,San Jose,CA,USA

4. TSMC,TCAD,Hsinchu,Taiwan

5. National Taiwan University,Graduate Institute of Photonics and Optoelectronics,Taipei,Taiwan

6. National Yang Ming Chiao Tung University,Department of Electrophysics,Hsinchu,Taiwan

7. National Yang Ming Chiao Tung University,Institute of Electronics,Hsinchu,Taiwan

Funder

National Science and Technology Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10413659/10413660/10413779.pdf?arnumber=10413779

Reference12 articles.

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