CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory
Author:
Affiliation:
1. Kioxia Corporation,Advanced Memory Development Center,Yokkaichi,Japan
Funder
Western Digital
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10413659/10413660/10413718.pdf?arnumber=10413718
Reference11 articles.
1. The Era of Advanced Packaging and Hybrid Bonding;Arkalgud
2. 3D Packaging for Heterogeneous Integration
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4. A back-illuminated global-shutter CMOS image sensor with pixel-parallel 14b subthreshold ADC
5. Unleash Scaling Potential of 3D NAND with Innovative Xtacking® Architecture
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