Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package
Author:
Affiliation:
1. North Carolina State University,Department of Mechanical and Aerospace Engineering,Raleigh,US
2. North Carolina State University,Department of Electrical and Computer Engineering,Raleigh,US
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10154896/10154899/10154901.pdf?arnumber=10154901
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1. Failure Life Prediction of Wafer Level Packaging using DoS with AI Technology
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5. Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module
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1. A 400W, 250kHz (2kW Peak) Integrated GaN Half Bridge Power Module in a Non-Isolated Buck Converter;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25
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