Author:
Green Daniel S.,Dohrman Carl L.,Demmin Jeffrey,Chang Tsu-Hsi
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal Analysis of 3D Heterogeneous Integration for Microwave HEMTs;2023 IEEE XVI International Scientific and Technical Conference Actual Problems of Electronic Instrument Engineering (APEIE);2023-11-10
2. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29
3. Simplified Evaluation on Cooling Performance of Silicon Microfluidic Interposer;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs;Electronics;2022-09-22
5. 3D
Design Styles;Handbook of 3D Integration;2019-02-08