Author:
Lamminen Antti,Lahti Markku,del Rio David,Saily Jussi,Sevillano Juan F.,Ermolov Vladimir
Cited by
8 articles.
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1. Embedded component packaging for D-band radio systems;2024 Joint European Conference on Networks and Communications & 6G Summit (EuCNC/6G Summit);2024-06-03
2. Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10
3. Modulated metasurface array for photonic beam steering at W band;2023 17th European Conference on Antennas and Propagation (EuCAP);2023-03-26
4. Effects of an IC Chip on an Antenna-IC Transition at 100 GHz;2023 17th European Conference on Antennas and Propagation (EuCAP);2023-03-26
5. A D-Band 16-Element Phased-Array Transceiver in 55-nm BiCMOS;IEEE Transactions on Microwave Theory and Techniques;2023-02