A <i>D</i>-Band 16-Element Phased-Array Transceiver in 55-nm BiCMOS-Reference-Cited by-同舟云学术

A D-Band 16-Element Phased-Array Transceiver in 55-nm BiCMOS

Published:2023-02 Issue:2 Volume:71 Page:854-869
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

del Rio David¹^ORCID,Sevillano Juan F.¹^ORCID,Torres Rolando¹^ORCID,Irizar Andoni¹,Roux Pascal²,Pirbazari Mahmoud M.³^ORCID,Mazzanti Andrea³^ORCID,Saily Jussi⁴^ORCID,Lamminen Antti⁴^ORCID,de Cos Jesus⁵,Frecassetti Mario Giovanni Luigi⁶,Moretto Maurizio⁶,Pallotta Andrea⁷,Ermolov Vladimir⁴

Affiliation:

1. Ceit-Basque Research and Technology Alliance (BRTA), Donostia-San Sebastian, Spain

2. Nokia Bell Labs France, Nozay, France

3. Department of Industrial and Information Engineering, University of Pavia, Pavia, Italy

4. VTT Technical Research Centre of Finland, Espoo, Finland

5. ERZIA Aerospace and Defense, ERZIA Technologies, Santander, Spain

6. Nokia X-Haul BU, Vimercate, Italy

7. STMicroelectronics, Cornaredo, Italy

Funder

European Union’s Horizon 2020 Research and Innovation Program

Spanish Ministry of Science and Innovation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx7/22/10040254/09894090.pdf?arnumber=9894090

Reference42 articles.

1. D-band Phased-Array TX and RX Front Ends Utilizing Radio-on-Glass Technology

2. Characterization of Interconnects on Multilayer High Frequency PCB for D- Band

3. An 84.48 Gb/s CMOS D-band Multi-Channel TX System-in-Package

4. Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

5. D-Band Transport Solution to 5G and Beyond 5G Cellular Networks

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