Degradation of epoxy insulation under combined high humidity and elevated temperature-Reference-Cited by-同舟云学术

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Degradation of epoxy insulation under combined high humidity and elevated temperature

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Container-title:Proceedings of 1994 4th International Conference on Properties and Applications of Dielectric Materials (ICPADM)
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Author:

Li Y.,Gao B.,Unsworth J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx2/3163/9216/00414120.pdf?arnumber=414120

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of transient temperature rise of MY1016 DC motor in standard cycle;AIP Conference Proceedings;2024

2. Accelerated hydrothermal aging of epoxy resin based syntactic foams with polymeric microspheres;IEEE Transactions on Dielectrics and Electrical Insulation;2012-06

3. Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing;Journal of Electronic Packaging;2005-06-01

4. Corrosion study of anisotropic conductive joints on polyimide flexible circuits;Materials Science and Engineering: B;2003-04

5. Investigation of thermal degradation behavior of polymeric composites: prediction of thermal cycling effect from isothermal data;Composites Part A: Applied Science and Manufacturing;2000-09

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