Author:
Cheng W.,Beiley M.A.,Wong S.S.
Cited by
3 articles.
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1. Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-11
2. A dry wafer-reconstitution process with zero insertion force by embedded alignment guide tabs;Journal of Micromechanics and Microengineering;2012-04-27
3. A micromachined array probe card-fabrication process;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1995