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Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices

  • Published:2019-11 Issue:11 Volume:9 Page:2305-2313
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Oakley ChristopherORCID,Albrecht John D.ORCID,Papapolymerou JohnORCID,Chahal Premjeet

Funder

Honeywell Federal Manufacturing and Technologies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

3. Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

4. High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing;2023 53rd European Microwave Conference (EuMC);2023-09-19

5. Process considerations for Aerosol-Jet printing of ultra fine features;Flexible and Printed Electronics;2023-07-20
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