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Analysis of Bipolar Integrated Circuit Degradation Mechanisms Against Combined TID–DD Effects

  • Published:2021-08 Issue:8 Volume:68 Page:1585-1593
  • ISSN:0018-9499
  • Container-title:IEEE Transactions on Nuclear Science
  • language:
  • Short-container-title:IEEE Trans. Nucl. Sci.

Author:

Ferraro RudyORCID,Alia Ruben GarciaORCID,Danzeca Salvatore,Masi AlessandroORCID

Funder

European Union’s Horizon 2020 Research and Innovation Programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Nuclear Energy and Engineering,Nuclear and High Energy Physics

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on Total Ionizing Dose Radiation Hardening by Design Method for Bandgap Reference Based on Real-Time Monitoring and Adaptive Compensation;Journal of Nanoelectronics and Optoelectronics;2024-08-01

2. Interference-induced Electromagnetic Emission in Functioning Operating States of Integrated Circuits;2023 International Symposium on Electromagnetic Compatibility – EMC Europe;2023-09-04

3. A Method to Measure the Electromagnetic Emission Induced by Electromagnetic Interference of Integrated Circuits;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23

4. Lightweight Omnidirectional Radiation Protection for a Photon-Counting Imaging System in Space Applications;Applied Sciences;2023-05-10

5. Reference Voltage Source Optimization;2022 IEEE 41st International Conference on Electronics and Nanotechnology (ELNANO);2022-10-10
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