Demonstration of 1200-V E-Mode GaN-on-Sapphire Power Transistor With Low Dynamic ON-Resistance Based on Active Passivation Technique
Author:
Affiliation:
1. School of Integrated Circuits, Peking University, Beijing, China
2. School of Physics, Peking University, Beijing, China
3. School of Integrated Circuits, Tsinghua University, Beijing, China
4. Enkris Semiconductor Inc., Suzhou, China
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/10415514/10352160.pdf?arnumber=10352160
Reference30 articles.
1. High Breakdown Voltage Achieved on AlGaN/GaN HEMTs With Integrated Slant Field Plates
2. Planar GaN Power Integration – The World is Flat
3. Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs
4. Epitaxial challenges of GaN on silicon
5. GaN-on-Si Power Technology: Devices and Applications
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1. Report of GaN HEMTs on 8-in Sapphire;IEEE Transactions on Electron Devices;2024-07
2. Metal/Insulator/p-GaN Gate Virtual-Body HEMT for Large Gate Swing and Effective hole Injection;2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2024-06-02
3. Demonstration of >8-kV GaN HEMTs With CMOS-Compatible Manufacturing on 6-in Sapphire Substrates for Medium-Voltage Applications;IEEE Transactions on Electron Devices;2024-06
4. Constructing drain surrounded double gate structure in AlGaN/GaN HEMT for boosting breakdown voltage;RSC Advances;2024
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