Scaling Study on High-Current Density Low-Dispersion GaN Vertical FinFETs
Author:
Affiliation:
1. Electrical Engineering Department, Stanford University, Stanford, CA, USA
Funder
Office of Naval Research
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/10109212/10076430.pdf?arnumber=10076430
Reference26 articles.
1. Schottky Junction Vertical Channel GaN Static Induction Transistor with a Sub‐Micrometer Fin Width
2. 1200 V GaN vertical fin power field-effect transistors
3. Characterization of m-GaN and a-GaN Crystallographic Planes after Being Chemically Etched in TMAH Solution
4. Small-Signal, High Frequency Performance of Vertical GaN FinFETs with fmax = 5.9 GHz
5. GaN vertical nanowire and fin power MISFETs
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Influence of Doping Engineering in 1 μm Drift Layer Quasi‐Vertical Fin Field‐Effect Transistor for Achieving >139 V Breakdown Voltage;physica status solidi (a);2024-07-25
2. Capacitance and Mobility Evaluation for Normally-Off Fully-Vertical GaN FinFETs;IEEE Transactions on Electron Devices;2023-08
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