Phased Array Antenna Element with Embedded Cavity and MMIC using Direct Digital Manufacturing
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8884354/8888025/08888323.pdf?arnumber=8888323
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs;2024 IEEE Wireless and Microwave Technology Conference (WAMICON);2024-04-15
2. Deep Learning-based RF Fingerprint Authentication with Chaotic Antenna Arrays;2023 IEEE Wireless and Microwave Technology Conference (WAMICON);2023-04-17
3. Additively Manufactured “Smart” RF/mm-Wave Packaging Structures: A Quantum Leap for On-Demand Customizable Integrated 5G and Internet of Things Modules;IEEE Microwave Magazine;2022-08
4. Packaging of a Beamforming IC by Laser Enhanced Direct Print Additive Manufacturing (LE-DPAM);2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting (AT-AP-RASC);2022-05-29
5. A Survey of 3D Printing Technologies as Applied to Printed Electronics;IEEE Access;2022
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