Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs-Reference-Cited by-同舟云学术

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Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs

Published:2016-03-01 Issue:3 Volume:65 Page:693-705
ISSN:0018-9340
Container-title:IEEE Transactions on Computers
language:
Short-container-title:IEEE Trans. Comput.

Author:

Yaghini Pooria M.^ORCID,Eghbal Ashkan,Yazdi Siavash S.,Bagherzadeh Nader,Green Michael M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Computational Theory and Mathematics,Hardware and Architecture,Theoretical Computer Science,Software

Link

http://xplorestaging.ieee.org/ielx7/12/7401237/7321791.pdf?arnumber=7321791

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Physical-aware Interconnect Testing and Repairing of Chiplets;2023 IEEE European Test Symposium (ETS);2023-05-22

2. Compact high-performance dual-frequency power divider based on TSV;Microelectronics Journal;2022-11

3. Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs;ACM Journal on Emerging Technologies in Computing Systems;2022-01-31

4. Characterization of corner/edge effects of through silicon via arrays and layout optimization in 3D integrated circuits;Japanese Journal of Applied Physics;2021-03-25

5. Making a Case for Partially Connected 3D NoC;ACM Journal on Emerging Technologies in Computing Systems;2020-10-02

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