Performanace and reliability analysis of 3D-integration structures employing Through Silicon Via (TSV)-Reference-Cited by-同舟云学术

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Performanace and reliability analysis of 3D-integration structures employing Through Silicon Via (TSV)

Published:2009 Issue: Volume: Page:
ISSN:
Container-title:2009 IEEE International Reliability Physics Symposium
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Author:

Karmarkar Aditya P.,Xu Xiaopeng,Moroz Victor

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5164157/5173200/05173329.pdf?arnumber=5173329

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