Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
5 articles.
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1. Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology;2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS);2023-10-25
2. Broadband RF Interconnects in a Multi-Layer Advanced Packaging with a Si Interposer;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
3. Research Progress and Prospect of Silicon-Based RF Microsystems;2022 10th International Symposium on Next-Generation Electronics (ISNE);2023-05-12
4. Tri-axis Polarized Loop Antenna for mmWave Wireless Inter/intra Chip Communications;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. On-Wafer Metrology for a Transmission Line Integrated Terahertz Source;Conference on Lasers and Electro-Optics;2020