Research Progress and Prospect of Silicon-Based RF Microsystems
Author:
Affiliation:
1. Nanjing Electronic Device Institute,Nanjing,China,210016
2. Shanghai Academy of Spaceflight Technology,Shanghai,China,201109
3. Shanghai Precision Metrology and testing research institute,Shanghai,China,201109
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10221568/10221569/10221571.pdf?arnumber=10221571
Reference10 articles.
1. Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
2. Embedded silicon fan-out (eSiFO): A promising wafer level packaging technology for multi-chip and 3D system integration [C];shuying;68th Electronic Components and Technology Conference (ECTC),2018
3. A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing
4. Heterogeneous Integration Using Omni-Directional Interconnect Packaging
5. Metal-Embedded Chip Assembly Processing for Enhanced RF Circuit Performance
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