Nonisothermal device simulation using the 2D numerical process/device simulator TRENDY and application to SOI-devices-Reference-Cited by-同舟云学术

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Nonisothermal device simulation using the 2D numerical process/device simulator TRENDY and application to SOI-devices

Published:1994-03 Issue:3 Volume:13 Page:293-302
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Wolbert P.B.M.,Wachutka G.K.M.,Krabbenborg B.H.,Mouthaan T.J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx1/43/6661/00265671.pdf?arnumber=265671

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