Funder
National Basic Research Program of China
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Cited by
5 articles.
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1. Stress isolations for resonant pressure micro sensors;Journal of Physics: Conference Series;2024-04-01
2. Study of the Sensitive Element of a Resonant Pressure Sensor with Membranes of Various Shapes;2023 Seminar on Microelectronics, Dielectrics and Plasmas (MDP);2023-11-20
3. Study on stress isolation structure of piezoresistive high-g accelerometer;Highlights in Science, Engineering and Technology;2022-09-30
4. 基于MEMS微镜角度反馈的新型封装应力隔离结构;ACTA PHOTONICA SINICA;2022
5. High Temperature Surface Acoustic Wave Sensor with Strain Isolation Structure;2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers);2021-06-20