100Gb/s PAM-4 VCSEL Driver and TIA for Short-Reach 400G-1.6T Optical Interconnects-Reference-Cited by-同舟云学术

100Gb/s PAM-4 VCSEL Driver and TIA for Short-Reach 400G-1.6T Optical Interconnects

Published:2021-11-22 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS)
language:
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Author:

Lu Donglai¹,He Jian¹,Li Weizhong²,Chen Sikai¹,Liu Jian¹,Wu Nanjian¹,Yu Ningmei³,Liu Liyuan¹,Chen Yong⁴,Xiao Xi²,Qi Nan¹

Affiliation:

1. Institute of Semiconductors, Chinese Academy of Sciences

2. National Information Optoelectronics Innovation Center

3. Xi'an University of Technology

4. University of Macau

Funder

China National Key R&D Program

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9687621/9687623/09687808.pdf?arnumber=9687808

Reference10 articles.

1. A $4\times25$ Gb/s Optical Transmitter Using Low-Cost 10 Gb/s VCSELs in 40-nm CMOS

2. 4×112 Gbps/Fiber CWDM VCSEL Arrays for Co-Packaged Interconnects

3. A 56 Gb/s PAM-4 linear transimpedance amplifier in $0.13-\mu \mathrm{m}$ SiGe BiCMOS technology for optical receivers;bhagavatheeswaran;2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS),0

4. 40 Gb/s PAM-4 Transmitter IC for Long-Wavelength VCSEL Links

5. A 50 Gb/s 190 mW Asymmetric 3-Tap FFE VCSEL Driver

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1. 4-channel, 224Gb/s PAM-4 optical transmitter with group delay compensation in 130-nm BiCMOS technology;IEICE Electronics Express;2023-10-25

2. 4-channel, 224 Gb/s PAM-4 optical transmitter with group delay compensation in 130-nm BiCMOS technology;IEICE ELECTRON EXPR;2023

3. A 6‐to‐38Gb/s capture‐range bang‐bang clock and data recovery circuit with deliberate‐current‐mismatch frequency detection and interpolation‐based multiphase clock generation;International Journal of Circuit Theory and Applications;2023-01-04

4. Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects;IEEE Transactions on Circuits and Systems I: Regular Papers;2022-11

5. A power‐efficient current‐integrating hybrid for full‐duplex communication over chip‐to‐chip interconnects;International Journal of Circuit Theory and Applications;2022-07-27