Effect of OA and JFCE As Surfactants on the Stability of Copper Interconnection CMP Slurry-Reference-Cited by-同舟云学术

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Effect of OA and JFCE As Surfactants on the Stability of Copper Interconnection CMP Slurry

Published:2022-06-20 Issue: Volume: Page:
ISSN:
Container-title:2022 China Semiconductor Technology International Conference (CSTIC)
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Author:

Yan Han¹,Niu Xinhuan¹,Luo Fu¹,Qu Minghui¹,Zhang Yinchan¹

Affiliation:

1. School of Electronics and Information Engineering, Hebei University of Technology,Tianjin,China,300130

Funder

Natural Science Foundation of Hebei Province

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856848.pdf?arnumber=9856848

Reference8 articles.

1. Potassium sorbate solutions as copper chemical mechanical planarization (CMP) based slurries

2. The combinatorial effect of complexing agent and inhibitor on chemical–mechanical planarization of copper

3. Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface

4. Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry

5. Effect of Non-Ionic Surfactant on Copper Dishing and Dielectric Erosion Correction in Alkaline Barrier CMP Solution Free of Inhibitors

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits;The International Journal of Advanced Manufacturing Technology;2023-01-03

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