Film Property Analysis by FTIR on ULK Film Deposition and UV Curing Process-Reference-Cited by-同舟云学术

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Film Property Analysis by FTIR on ULK Film Deposition and UV Curing Process

Published:2022-06-20 Issue: Volume: Page:
ISSN:
Container-title:2022 China Semiconductor Technology International Conference (CSTIC)
language:
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Author:

Cai Xinchen¹,Teng Tianjiao¹,Lin Xuanyu¹,Li Peipei¹,Chen Xinyi¹,Wang Zhuo¹,Tan Huaqiang¹,Mi Qing²,Zhang Bo²,Liu Jintao²

Affiliation:

1. Piotech Technology Co., LTD,Shenyang city,Liaoning Province,110171

2. SMNC Co., LTD,China,100176

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856724.pdf?arnumber=9856724

Reference6 articles.

1. Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization

2. Investigation of deposition temperature effect on properties of PECVD SiOCH low-k films

3. Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects

4. Dielectric properties of aerogels

5. Low-k dielectric materials

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