Study on Process Improvement and Yield Enhancement of 40Nm E-Flash AIO Wet Strip
Author:
Affiliation:
1. Shanghai Huali Integrated Circuit Manufacturing Corporation,Shanghai,P.R.China,201315
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856888.pdf?arnumber=9856888
Reference5 articles.
1. Effects of fluoride residue on Cu agglomeration in Cu/low-k interconnects
2. Optimization of wet clean and its cost effectiveness in dual Damascene 14 nm BEOL
3. Optimization of Wet strip after Metal Hard Mask All-in-One Etch for metal void reduction and yield improvement
4. Cleaning and Surface conditioning Technology in Semiconductor Device Manufacturing 10;hattori;ECS Transactions,0
5. Advanced Interconnects: Materials, Processing, and Reliability
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