Certain Investigation on Impedance control of High Speed signals in Printed Circuit Board
Author:
Affiliation:
1. Hindustan Institute of Technology and Science,Department of ECE,Chennai,Tamil Nadu,India
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9850395/9850438/09850584.pdf?arnumber=9850584
Reference15 articles.
1. Experimental Dynamic Characterization of Rigid-Flex PCB Systems
2. Experimental Noise and Signal Analysis on Printed Circuits Board Design
3. Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board
4. An Amplified Multi Equalizer Model in LTE-OFDM System for BER Performance
5. Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder Balls
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