Robust automatic void detection in solder balls-Reference-Cited by-同舟云学术

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Robust automatic void detection in solder balls

Published:2010 Issue: Volume: Page:
ISSN:
Container-title:2010 IEEE International Conference on Acoustics, Speech and Signal Processing
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Author:

Said Asaad F.,Bennett Bonnie L.,Karam Lina J.,Pettinato Jeff

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5487364/5494886/05495524.pdf?arnumber=5495524

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Convolutional Attention Network with edge supervision for void and spot segmentation in chip resistors based on X-ray images;Optics and Lasers in Engineering;2024-07

2. Detection and location of mount chip and solder joint based on machine vision;Signal, Image and Video Processing;2024-05-23

3. Automated X-ray Defect Inspection on Occluded BGA Balls Using Hybrid Algorithm;Computers, Materials & Continua;2023

4. Void and solder joint detection for chip resistors based on X-ray images and deep neural networks;Microelectronics Reliability;2022-08

5. Layered Unsupervised Learning-based Identification and Quantification of Voids in Package Thermal Interface Materials;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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