Electro-thermal modeling of high power IGBT module short-circuits with experimental validation-Reference-Cited by-同舟云学术

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Electro-thermal modeling of high power IGBT module short-circuits with experimental validation

Published:2015-01 Issue: Volume: Page:
ISSN:
Container-title:2015 Annual Reliability and Maintainability Symposium (RAMS)
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Author:

Wu Rui,Iannuzzo Francesco,Wang Huai,Blaabjerg Frede

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7101335/7105053/07105151.pdf?arnumber=7105151

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electro-Thermal Digital Twin for GaN eHEMT Power Modules Temperature Characterization during Power Cycling Tests;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

2. Multidimensional Mission-Profile-Based Lifetime Estimation Approach for IGBT Modules in MMC–HVdc Application Considering Bidirectional Power Transfer;IEEE Transactions on Industrial Electronics;2023-07

3. A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss;IEEE Transactions on Electron Devices;2022-12

4. Modeling method for electrothermal cosimulation of high‐power IGBT;IEEJ Transactions on Electrical and Electronic Engineering;2019-07-25

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