Study on the Slurry for Chemical Mechanical Polishing of Sapphire Wafer
Author:
Affiliation:
1. Hebei University of Technology,School of Electronics and Information Engineering,Tianjin,People’s Republic of China,300130
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10219185/10219154/10219351.pdf?arnumber=10219351
Reference6 articles.
1. Function of liquid and tool wear in ultrasonic bound-abrasive polishing of fused silica with different polishing tools
2. A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass
3. Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing
4. Zeta potential-tunable silica abrasives and fluorinated surfactants in chemical mechanical polishing slurries
5. Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
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