Faster AU-AL IMC Growth Under Chlorine Environment-Reference-Cited by-同舟云学术

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Faster AU-AL IMC Growth Under Chlorine Environment

Published:2023-06-26 Issue: Volume: Page:
ISSN:
Container-title:2023 China Semiconductor Technology International Conference (CSTIC)
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Author:

Lois Liao Jinzhi¹,Bisheng Wang²,Xi Zhang¹,Younan Hua¹,Xiaomin Li³

Affiliation:

1. WinTech Nano-Technology Services Pte. Ltd.,10 Science Park Road, #03-26, The Alpha Science Park II,Singapore,117684

2. Huawei Technologies Co Ltd, Bantian Huawei Base, Longgang District,Shenzhen,China,518129

3. Wintech-Nano (Suzhou) Co., Ltd., Room 507, Building 09, Northwest District, Nano City, No. 99, Jinjihu Ave, Suzhou Industrial Park,Suzhou,China,215123

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10219185/10219154/10219408.pdf?arnumber=10219408

Reference6 articles.

1. What is the future of bonding wire? Will copper entirely replace gold?

2. Bromine- and chlorine-induced degradation of gold-aluminum bonds

3. Extended reliability of gold and copper ball bonds in microelectronic packaging

4. Fine pitch copper wire bonding in high volume production

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