An Adaptive Controlled Chip-Level Wireless Power Transfer System with DPID Controller for Wireless 3-D Stacked Chips
Author:
Affiliation:
1. Zhejiang University,School of Micro-Nano Electronics,Hangzhou,china,311200
2. JCET Group Co., Ltd,Shanghai,china
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10219185/10219154/10219202.pdf?arnumber=10219202
Reference6 articles.
1. 1GHz wireless power delivery using 0.2×0.2mm2 on-chip inductor for 3-D stacked chips
2. A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link
3. A 13.56 MHz Wireless Power Transfer System With Reconfigurable Resonant Regulating Rectifier and Wireless Power Control for Implantable Medical Devices
4. Simultaneous 6Gb/s data and 10mW power transmission using nested clover coils for non-contact memory card
5. Reliability Challenges in 2.5D and 3D IC Integration
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