Simultaneous 6Gb/s data and 10mW power transmission using nested clover coils for non-contact memory card-Reference-Cited by-同舟云学术

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Simultaneous 6Gb/s data and 10mW power transmission using nested clover coils for non-contact memory card

Published:2010-06 Issue: Volume: Page:
ISSN:
Container-title:2010 Symposium on VLSI Circuits
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Author:

Yuan Yuxiang,Radecki Andrzej,Miura Noriyuki,Aikawa Iori,Take Yasuhiro,Ishikuro Hiroki,Kuroda Tadahiro

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5552635/5560242/05560298.pdf?arnumber=5560298

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2. Shape of Integrated System Interfacing between Cyber and Physical Space;IEICE ESS Fundamentals Review;2023-01-01

3. Emerging Computing Systems Utilizing Electro-Magnetic Near-Field Connectivity;2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT);2022-08-29

4. ThruChip Interface;Wireless Interface Technologies for 3D IC and Module Integration;2021-09-30

5. A Sub-THz Wireless Power Transfer for Non-Contact Wafer-Level Testing;Electronics;2020-07-28

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