Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion
Author:
Affiliation:
1. Infineon Technologies AG,Stress and Test Laboratory,Munich,Germany
2. Infineon Technologies AG,Package Reliability,Munich,Germany
3. Technische Universitat Chemnitz,Professorship Materials and Reliability of Microsystems,Chemnitz,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939479.pdf?arnumber=9939479
Reference13 articles.
1. Low Cycle Fatigue of Thin Metal Films on Vibrating Silicon MEMS Cantilevers: Finite Element Modelling Facilitating Experimental Design
2. VEDDAC;Chemnitzer Werkstoffmechanik GmbH,0
3. DIN EN ISO 25178–2:2020-02, Geometrische Produktspezifikation (GPS) - Oberflachenbeschaffenheit: Flachenhaft - Teil 2: Begriffe, Definitionen und Oberflachen-Kenngroßen (ISO/DIS 25178–2:2019);Deutsche und Englische Fassung prEN ISO 25178–2 2019,2020
4. Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling
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