Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling-Reference-Cited by-同舟云学术

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Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling

Published:2017-09 Issue: Volume: Page:
ISSN:
Container-title:2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Zhu Qingwei,Forsyth Andrew,Todd Rebecca,Mills Liam

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8206642/8233782/08233804.pdf?arnumber=8233804

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Low-Thermal-Stress Double-Sided Cooling Wire-Bondless Package Structure of SiC Power Modules for High-Temperature Applications;IEEE Transactions on Power Electronics;2024-11

2. A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters;IEEE Transactions on Power Electronics;2024-09

3. A Double-Sided Cooled Power Module With Embedded Decoupling Capacitors;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-04

4. Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding;2023 11th International Conference on Control, Mechatronics and Automation (ICCMA);2023-11-01

5. A Novel Integrated 1.2 kV Double-sided Cooled Power Module;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

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