No-Reference Image Quality Assessment for Reverse Engineering of Integrated Circuits
Author:
Affiliation:
1. Technical University of Munich,Chair for Robotics, Artificial Intelligence and Embedded Systems,Germany
2. Infineon Technologies AG,Munich,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249049.pdf?arnumber=10249049
Reference27 articles.
1. Scanning electron microscopy: an introduction
2. Electron microscopy in semiconductor inspection
3. Simultaneous Scanning Electron Microscope Imaging of Topographical and Chemical Contrast Using In-Lens, In-Column, and Everhart–Thornley Detector Systems
4. Scanning Microscopy for Nanotechnology
5. Scanning Electron Microscopy
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. SECURE: A Segmentation Quality Evaluation Metric on SEM Images for Reverse Engineering on Integrated Circuits;IEEE Access;2023
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