Novel Detachable & Flippable Probing Stage for Lock-in Thermography and Laser-based Fault Isolation Tool-Reference-Cited by-同舟云学术

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Novel Detachable & Flippable Probing Stage for Lock-in Thermography and Laser-based Fault Isolation Tool

Published:2023-07-24 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Author:

Izlan M. A. A¹,Zamri M. S. Muhamad¹,Ooi Y. K¹,Ng C. Y.¹,Ng J. C.¹

Affiliation:

1. Corporate Quality Network, Intel Technology (M),Penang,Malaysia,11900

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10248978/10248979/10248980.pdf?arnumber=10248980

Reference6 articles.

1. Localization of electrical defects in system in package devices using Lock-in Thermography

2. Lock-in Infrared Thermography: A tool to locate and analyse failures in power devices

3. Power Plane Defect Findings in Silicon with Lock- In Thermography & OBIRCH/TIVA Techniques

4. 3D Defect Localization of Stacked Die Devices by Lock-in Thermography (LIT)

5. Defect Z-depth Determination in Flip-chip using lock-in thermography

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