A Combination of Implant Shadow and Skin Effects Leading to HV Devices Failure during the ESD Event

Author:

Lee Jian-Hsing1,Li Ching-Ho2,Liao Chih-Cherng2,Huang Yeh-Jen1,Nidhi Karuna3,Hong Li-Yang1,Lin Ting-You1,Jou Yeh-Ning1,Huang Shao-Chang1,Chen Ke-Horng2

Affiliation:

1. Vanguard International Semiconductor Corp.,DE Department,HsinChu City,Taiwan

2. National Yang Ming Chiao Tung University,Department of Electrical and Computer Eng.,HsinChu City,Taiwan

3. Richtek Technology Corp.,ESD Department,ChuPei City,Taiwan

Publisher

IEEE

Reference24 articles.

1. The effect of implant angle and resist shadowing in submicron implant technology;lee;Master Dissertation,2006

2. System-Level ESD-Induced Voltage Fluctuation to the Power of Integrated Circuits on System Board

3. Doping channeling as a function of implant angle for low energy applications;walther;Proc Int Conf Ion Implantation Technol,1998

4. The positive trigger voltage lowering effect for latch-up;lee;Proc IEEE Int Symp Phys and Failure Anal Integr Circuits,2004

5. RESURF Region Variation Induced Current Crowding Effect on HV p-LDMOS

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. RESURF Region Variation Induced Current Crowding Effect on HV p-LDMOS;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

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