A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
Author:
Affiliation:
1. SEKISUI CHEMICAL CO., LTD. 2-1 Hyakuyama, Shimamoto-cho, Mishima-gun,Osaka,JAPAN,618-0021
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966704.pdf?arnumber=9966704
Reference15 articles.
1. Ultra High Density SoIC with Sub-micron Bond Pitch
2. Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications
3. Electromigration in 2 μm Redistribution Lines and Cu-Cu Bonds with Highly <111>- oriented Nanotwinned Cu
4. Bonding integrity enhancement in wafer to wafer fine pitch hybrid bonding by advanced numerical modelling
5. Numerical Evaluation on SiO2 Based Chip to Wafer Hybrid Bonding Performance by Finite Element Analysis
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