Selective Cu electrodeposition for Through Glass Via (TGV)
Author:
Affiliation:
1. Hanyang University,Department of Material Science & Engineering,Ansan-si,Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10102927/10102928/10103018.pdf?arnumber=10103018
Reference5 articles.
1. Periodic Pulse Reverse Cu Plating for Through-Hole Filling
2. Characterization of Through-Hole Filling by Copper Electroplating Using a Tetrazolium Salt Inhibitor
3. Continuous Ni-layer on multiwall carbon nanotubes by an electroless plating method
4. Highly Selective Cu Electrodeposition for Filling Through Silicon Holes
5. The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)
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