Process Control Challenges and Solutions for Advanced Semiconductor Devices

Author:

Jee Yun Jung1,Han Sang Hyun2,Wolfling Shay3

Affiliation:

1. Nova Measuring Instruments, LTD,Gyeonggido,Korea

2. Nova Measuring Instruments, Inc.,Fremont,CA,USA,94538

3. Nova LTD,Rehovot,Israel,76100

Publisher

IEEE

Reference14 articles.

1. A holistic metrology sensitivity study for pattern roughness quantification on EUV Patterned device structures with mask design induced roughness;levi;Proc SPIE,0

2. Advanced machine learning eco-system to address HVM optical metrology requirements

3. Evaluation of deep learning model for 3D profiling of HAR features using high-voltage CD-SEM

4. In-line XPS metrology using unsupervised machine learning in high volume manufacturing;paul;Proc SPIE PC12053 PC120530M,0

5. OCD enhanced: implementation and validation of spectral interferometry for nanosheet inner spacer indentation

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