High-density flexible interconnect for two-dimensional ultrasound arrays-Reference-Cited by-同舟云学术

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High-density flexible interconnect for two-dimensional ultrasound arrays

Published:2000-05 Issue:3 Volume:47 Page:764-770
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Fiering J.O.,Hultman P.,Lee W.,Light E.D.,Smith S.W.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx5/58/18204/00842067.pdf?arnumber=842067

Cited by 41 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flexible ultrasound arrays with embossed polymer structures for medical imaging;Journal of Semiconductors;2024-08-01

2. Piezoelectric Micromachined Ultrasound Transducer Technology: Recent Advances and Applications;Biosensors;2022-12-29

3. 2-D Array Design and Fabrication With Pitch-Shifting Interposer at Frequencies From 4 MHz up to 10 MHz;IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control;2022-12

4. Fine Pitch Flexible Printed Circuit Board Patterning for Miniaturized Endoscopic MicroUltrasound Arrays;IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control;2022-10

5. A 30-MHz, 3-D Imaging, Forward-Looking Miniature Endoscope Based on a 128-Element Relaxor Array;IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control;2021-04

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