2-D Array Design and Fabrication With Pitch-Shifting Interposer at Frequencies From 4 MHz up to 10 MHz-Reference-Cited by-同舟云学术

2-D Array Design and Fabrication With Pitch-Shifting Interposer at Frequencies From 4 MHz up to 10 MHz

Published:2022-12 Issue:12 Volume:69 Page:3382-3391
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Kang Haochen¹^ORCID,Sun Yizhe¹^ORCID,Wodnicki Robert¹^ORCID,He Qingqing²,Zeng Yushun¹^ORCID,Lu Gengxi¹^ORCID,Yeom Jung-Yeol³,Yang Yang²,Zhou Qifa¹^ORCID

Affiliation:

1. Department of Biomedical Engineering, USC Roski Eye Institute University of Southern California, Los Angeles, CA, USA

2. Department of Mechanical Engineering, San Diego State University, San Diego, CA, USA

3. School of Biomedical Engineering, Korea University, Seoul, South Korea

Funder

U.S. National Institutes of Health

Unrestricted University of Southern California (USC) Steven Innovative Grant

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/58/9963905/09933717.pdf?arnumber=9933717

Reference33 articles.

1. High Frequency 1.75D array using a 3D printed pitch-changing interposer backing

2. Noninvasive Ultrasound Retinal Stimulation for Vision Restoration at High Spatiotemporal Resolution

3. PIN-PMN-PT single crystal composite and 3D printed interposer backing for ASIC integration of large aperture 2D array;wodnicki;Proc IEEE Int Ultrason Symp (IUS),2017

4. Transforming 3D-printed mesostructures into multimodal sensors with nanoscale conductive metal oxides

5. High-density flexible interconnect for two-dimensional ultrasound arrays

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