A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind
Author:
Affiliation:
1. Department of Chemistry, Grove Building Extension, Swansea University, Swansea, U.K.
2. SPTS Technologies Ltd., Newport, U.K
3. Department of Chemistry, Swansea University, Swansea, U.K
Funder
SPTS Technologies Ltd
Application Specific Semiconductor Etch Technology
Welsh Government Smart Expertise Programme
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/66/10119187/10066867.pdf?arnumber=10066867
Reference32 articles.
1. Chemical Mechanical Polishing Method and Practice
2. Extreme wafer thinning optimization for via-last applications
3. Oxide-chemical mechanical polishing characteristics using silica slurry retreated by mixing of original and used slurry
4. Plasma diagnostics of a SF6radiofrequency discharge used for the etching of silicon
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