Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
22 articles.
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1. A Direct-solution Fuzzy Collaborative Intelligence Approach for Yield Forecasting in Semiconductor Manufacturing;Procedia Manufacturing;2018
2. Load-Aware Redundant Via Insertion for Electromigration Avoidance;Proceedings of the 2016 on International Symposium on Physical Design;2016-04-03
3. Lithography-Aware Analog Layout Retargeting;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2016-02
4. Redundant Via Insertion Based on SCA;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2016-02
5. A method for timing constrained redundant via insertion;Journal of Semiconductors;2014-04