Author:
Mackowiak Piotr,Erbacher Kolja,Schiffer Michael,Ngo Ha-Duong,Schneider-Ramelow Martin,Lang Klaus-Dieter
Cited by
2 articles.
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1. RF models for Through SiC Vias for Highly Integrated Interposer Technology;2023 Smart Systems Integration Conference and Exhibition (SSI);2023-03-28
2. SiC Fan-out Wafer Level Package for High Power Application;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07