Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Author:
Affiliation:
1. Fraunhofer ENAS,Chemnitz,Germany,09126
2. TU Chemnitz,Zentrum für Mikrotechnologien (ZfM),Germany
3. University of Freiburg,Laboratory for Assembly and Packaging Technology,Department of Microsystems Engineering (IMTEK),Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9229482/9229650/09229761.pdf?arnumber=9229761
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