Mission Profile related Design for Reliability for Power Electronics based on Finite Element Simulation
Author:
Affiliation:
1. Fraunhofer ENAS,Chemnitz,09126
2. Nexperia,Hamburg,Germany,22529
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457766.pdf?arnumber=10457766
Reference7 articles.
1. Comparative Analysis of Traction Inverter Controllers for the Mission-Profile Oriented Reliability and Performance Evaluation in Electric Vehicles
2. Real-Life Mission Profile Oriented Lifetime Estimation of a SiC Interleaved Bidirectional HV DC/DC Converter for Electric Vehicle Drivetrains
3. Viscoplastic Anand model for solder alloys and its application
4. Building reliable FE simulation models for a better behavior prediction of power electronic systems
5. Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
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1. Influence of Material Properties on Ruggedness Evaluation of Package Architectures for SiC Power Devices;Solid State Phenomena;2024-08-23
2. A Link Between the Lab and the Real World - A Setup for Accelerated Aging of Power Electronics Using Mission Profiles from the Field;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
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