Characterization of a Wafer-Level Packaged Au−Ru/AlCu Contact for Micro-Switches

Author:

Najah Mohamed1ORCID,Ecoffey Serge1ORCID,Singh Tejinder2ORCID,Ferguson Mark1ORCID,Roby Louis-Philippe1,Renaud Jacques3,Gondcharton Paul3,Banville Frederic A.3ORCID,Boucherit Mohamed3ORCID,Charlebois Serge A.1ORCID,Frechette Luc G.1ORCID,Mansour Raafat R.2ORCID,Boone Francois1ORCID

Affiliation:

1. Faculty of Engineering, University of Sherbrooke, Sherbrooke, QC, Canada

2. Department of Electrical and Computer Engineering, Centre for Integrated RF Engineering (CIRFE), Waterloo Institute for Nanotechnology, University of Waterloo, Waterloo, ON, Canada

3. Teledyne DALSA, J2L 1S7, Bromont, QC, Canada

Funder

Natural Sciences and Engineering Research Council of Canada

Prompt

MITACS

Teledyne DALSA Semiconductor

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Comprehensive Review of RF MEMS Switches in Satellite Communications;Sensors;2024-05-15

2. DC Hot Switching Lifetime Study for Contact MEMS Switch by Weibull Distribution Analysis;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21

3. Investigation of Thermal Creep in Metal-Based MEMS Cantilevers;Journal of Microelectromechanical Systems;2023-10

4. Robust Fulcrum-Type Wafer-Level Packaged MEMS Switches Utilizing Al-Ru/AlCu Contacts Fabricated in a Commercial MEMS Foundry;2023 IEEE/MTT-S International Microwave Symposium - IMS 2023;2023-06-11

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